Innovative Two Phase Cooling Solution

The VaporCool System is an innovative two-phase cooling solution that utilizes patented technology to deliver exceptional reliability and efficiency. By leveraging the enthalpy of vaporization, it effectively transfers heat from critical components, GPUs, to an external heat exchange system. Its patented splitable design is optimized for compact environments, including 2U servers, offering superior cooling performance and energy savings.

We solve the AI heat crisis by eliminating compressors and simplifying infrastructure. Using a negative-pressure pure-water loop, our PFAS-free system operates at 35°C ambient with ultra-low leakage risk. Delivering plug-and-play deployment, we cut facility cooling energy by 97%. Let's transform AI thermal management from a massive cost into your sustainable competitive advantage.

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Latest information is currently being prepared.
Want an early look at our latest technology? Join us for a chat at the 2026 OCP EMEA Summit (Booth #62) to discuss your specific thermal management needs!

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What's Next in 2026?

VaporCool

Validated by Tier-1 Server OEM & 24-Hour POC Testing 

• PUE < 1.1 @ 1LPM under Tcase 80C

          Field-test of 1.072 under 24 hour testing.

• 2.5kW TDP per Chip Capacity

          Handling High Heat Flux up to 300 W/cm2.

• Reliable Parallel Cooling Structure

          Dual Parallel TTVs Stability Proven.

Pin-fin Structure

The modular design allows it to integrate seamlessly with existing liquid cooling infrastructure. 

VaporCool is designed in the height of 2U. 

Two-phase cold plates efficiently remove heat from processors and high-power components by utilizing the latent heat of vaporization during the liquid-to-vapor phase transition of the coolant. Compared with single-phase cold plates, which primarily rely on liquid circulation and temperature rise for heat dissipation, two-phase cold plates can transfer substantial amounts of thermal energy at lower flow rates and with smaller temperature variations. This makes them particularly suitable for high-heat-flux applications, including AI processors, GPUs, and high-power electronic equipment.

Pure Water Negative-Pressure Two-Phase Cooling Technology

boiling point CreAlien has developed Water Two-Phase Cooling (W2PC) technology, which utilizes a low-pressure circulation environment to lower the of pure water, allowing it to vaporize inside the cold plate at an operating temperature of approximately 45°C. As pure water absorbs heat from the chip, it transforms into vapor and subsequently condenses back into liquid, establishing a continuous cooling cycle.

By leveraging phase-change heat transfer, the system achieves highly efficient cooling at lower liquid flow rates while reducing pump power consumption and the demands on the fluid circulation system. Under specific design and testing conditions, the heat transfer performance of two-phase cooling can be approximately 10 to 20 times greater than that of conventional single-phase convective cooling. Actual performance depends on factors such as operating pressure, flow rate, heat flux, flow channel geometry, and condenser system design.

Key Features

1. Precision Flow Channel Design and Two-Phase Flow Control

Both liquid and vapor coexist within the flow channels of a two-phase cold plate. The flow channel design must carefully balance coolant distribution, vapor removal, and condensate return. Improper design may lead to flow instability, localized dry-out, or thermal hotspots.

Through precision machining and process control, CreAlien carefully manages microchannel geometry and distribution to ensure stable coolant flow across high-heat-load regions while facilitating efficient vapor removal and recovery.

2. High-Density and Space-Efficient Thermal Design

As the power density of AI processors and high-performance computing components continues to increase, cooling systems must accommodate greater thermal loads within limited installation spaces. By utilizing phase-change heat transfer, two-phase cold plates provide highly efficient chip-level cooling without requiring a substantial increase in liquid flow rates.

CreAlien offers customized cold plate structures, flow channel layouts, inlet and outlet configurations, and condensation circulation systems based on customer requirements, helping customers achieve high-power, high-reliability thermal management integration within space-constrained environments.

3. Customized System Integration

The performance of a two-phase cold plate depends on the coordinated operation of its structural design, operating pressure, coolant flow rate, and condensation system. Based on the thermal loads and installation requirements of AI processors, data center servers, power electronics, and other high-power devices, CreAlien provides tailored two-phase cooling solutions that meet requirements for thermal performance, fluid control, manufacturing precision, and system integration.

Contact CreAlien Today to Start Your High-Performance Pure Water Two-Phase Cooling Project!

In-Rack Coolant Distribution Unit (CDU): The Heart of High-Density Thermal Management

The central nervous system of your high-density rack, providing precision-controlled, two-phase liquid cooling for the AI era.

As AI workloads push server power consumption beyond the limits of traditional air cooling, the infrastructure that delivers coolant to the chip becomes as critical as the chip itself. Our in rack CDU (Coolant Distribution Unit) is specifically engineered to manage the complex requirements of DI water two-phase cooling (W2PC). By decoupling the secondary IT loop from the primary facility water, our CDU ensures that your high-performance GPUs receive the exact thermal regulation they need to maintain peak performance without thermal throttling.

Key Features & Strategic Advantages

• Precision Two-Phase Management: Optimized to handle the specific flow and pressure requirements of phase-change cooling, ensuring uniform DI water delivery to every server node.

• PFAS-Free Safety: Designed exclusively for use with high-resistivity DI water, eliminating the environmental and health risks associated with chemical forever chemicals (PFAS).

• Compact In-Rack Footprint: Available in standard 4U to 8U configurations, our in rack CDU saves valuable "white space" by eliminating the need for bulky, room-scale cooling units.

• Chiller-less Compatibility: Capable of operating with high facility return water temperatures, significantly lowering your data center’s PUE and overall energy costs.

• Smart Monitoring & Leak Detection: Integrated with advanced IoT sensors for real-time flow, pressure, and resistivity monitoring, featuring automated shut-off protocols for maximum safety.

Detailed Product Introduction: The W2PC Series CDU

Our in rack CDU is more than just a pump—it is an intelligent thermal interface. In a traditional liquid cooling setup, water simply carries heat away by getting warmer. Our CDU supports the Water-to-Phase Cooling (W2PC) process, where heat is removed through the latent heat of vaporization using high-purity DI water.

By sitting directly within the server rack, the CDU minimizes the "travel distance" of the coolant, reducing pumping power and improving the response time to sudden heat spikes typical of AI training and inference. Its modular design allows for "N+1" redundancy, ensuring that even in the event of a component failure, your mission-critical AI clusters continue to operate. Whether you are retrofitting an existing data center or building a greenfield AI factory, our CDU provides the scalability needed to grow from a single rack to a massive high-density deployment.

Product Series Comparison

Targeted Application Fields

• AI Data Centers & HPC: Precise thermal management for dense GPU clusters (H100/B200/GB200).

• Edge Computing Nodes: Delivering enterprise-grade cooling in compact, remote locations.

• Enterprise R&D Labs: Enabling high-performance simulation and modeling in standard office environments.

• Modular Data Centers (MDC): The core cooling component for rapid-deployment containerized sites.

Proven Success Stories

• Hyperscale Cloud Provider: Implemented our in rack CDU to support 80kW AI racks using a DI water loop, successfully achieving a PUE of 1.08.

• SEMICON Taiwan 2025: Showcased the precision and reliability of our two-phase delivery system under high-stress exhibition conditions.

• National Research Center: Optimized a liquid-cooled supercomputing cluster using our VC-CDU series, reducing maintenance frequency by 20% while ensuring ionic purity.

💡 Still evaluating the best cooling path for your needs?

If you are planning a new data center but have not yet decided between air cooling, liquid cooling, or other more advanced architectures, please explore our dedicated service: "Cooling & Thermal System Design to Maintain." Our team, led by experts like Michael Wei, will tailor the optimal thermal management solution based on your specific facility, hardware requirements, and budget.

Consult with Our Technical Team Today

This page is under construction, coming soon !

Want an early look at our latest technology? Join us for a chat at the 2026 COMPUTEX(Booth #R0128) to discuss your specific thermal management needs!

This page is under construction, coming soon !

Want an early look at our latest technology? Join us for a chat at the 2026 COMPUTEX(Booth #R0128) to discuss your specific thermal management needs!

Different computing environments require different cooling approaches. CreAlien's Data Center Cooling Solutions are available in two deployment models: VC-Lite for micro data center environments and VC-Pro for enterprise-scale AI and HPC deployments.

VC-Lite: Plug-and-Play Micro Data Center Cooling Solution 

VC-Lite is a self-contained micro data center cooling solution designed for computing environments with workloads supporting 20 kW and 80 kW based on in-rack design. 

• Minimal Facility Requirements 

VC-Lite integrates cooling components within a self-contained platform, reducing the need for dedicated piping, facility upgrades, and other supporting infrastructure.

• Plug-and-Play Deployment 

VC-Lite is designed as a plug-and-play solution. Simply connect power and begin operation without the extensive installation work typically associated with conventional liquid cooling systems.

• Compact and Office-Friendly Design 

Compared to conventional air-cooled systems, VC-Lite offers a more compact footprint and quieter operation, making it suitable for offices, laboratories, and edge computing deployments.

VC-Pro: Enterprise AI Data Center Cooling Solution 

VC-Pro is an In-Row cooling solution designed for AI data centers and HPC environments with thermal loads exceeding 200 kW per row. It provides centralized liquid cooling infrastructure for high-density computing deployments.

• Chiller-Less Cooling Architecture 

VC-Pro is designed to operate using standard facility water, eliminating the need for dedicated chiller systems commonly used in conventional liquid cooling environments.

• Reduced Non-Compute Infrastructure 

Eliminating chiller systems also reduces the space required for supporting cooling equipment. This allows a greater proportion of the facility to be dedicated to computing resources rather than mechanical infrastructure.

• High-Density Cooling Support 

Designed for thermal loads exceeding 200 kW per row, VC-Pro supports AI factories and HPC environments where conventional cooling approaches may struggle to meet increasing heat dissipation requirements.

• Energy-Efficient Operation 

By reducing reliance on energy-intensive chilling systems, VC-Pro helps improve overall cooling efficiency and can support data center designs targeting a PUE below 1.1.

Solution Comparison 

From micro data center deployments to enterprise AI facilities, CreAlien provides cooling solutions designed for different infrastructure requirements. Contact us to discuss the right solution for your application.