Direct Liquid Cooling

Direct Liquid Cooling Solution

Direct-to-Chip (D2C) Liquid Cooling is currently the mainstream thermal management technology for high-performance computing (HPC) and high-end AI data centers. Unlike the indirect heat transfer of traditional air cooling, D2C routes liquid coolant—which possesses a significantly higher heat capacity—directly into cold plates mounted on core heat-generating components like CPUs and GPUs. The coolant absorbs massive thermal loads at the source and transports the heat away from the rack via a distribution network, achieving ultimate heat transfer efficiency.

For clients who have already decided to implement a liquid-cooled architecture, we provide end-to-end services, from facility-level pipeline layout and fluid dynamics optimization to the precise selection and system integration of core liquid cooling components (including Cold Plates, CDUs, Manifolds, and UQDs). Whether you are retrofitting a single high-end AI rack or constructing a hyperscale liquid-cooled data center, our engineering team will build the safest, most stable thermal environment for you.

Core Advantages:

Pipeline & Fluid Planning: Executing precise fluid dynamics and pressure drop simulations for high-density racks and Facility Water Systems (FWS) to optimize overall coolant routing.

Precision Liquid Cooling Ecosystem Integration: Integrating our high-performance Cold Plates, In-Rack/In-Row CDUs, Manifolds, and UQDs to perfectly match and orchestrate the ideal liquid cooling components for your system.

Prevention & Reliability: Implementing industry-leading leak-proof designs and rigorous pressure testing, coupled with intelligent leak detection systems, to ensure absolute safety during continuous high-pressure operations.

PUE Optimization: By directly removing up to 90% of server-generated heat, we enable high-power AI chips to operate at 100% capacity, driving your facility toward low PUE.

💡 Still evaluating the best cooling solution for your needs?
If you are planning a new data center but have not yet decided between air cooling, liquid cooling, or other more advanced architecture, please explore our dedicated service: "Cooling & Thermal System Design to Maintain". Our team will tailor the optimal thermal management solution based on your specific facility and budget.

Single Phase Cold Plate

Cold plate cooling plays a critical role in direct liquid cooling by transferring heat from processors and other high-power components to circulating coolant. The cooling performance of a liquid cold plate depends not only on coolant flow but also on factors such as flow path design, thermal contact, and manufacturing precision. The following features highlight the key advantages of CreAlien’s Single Phase Cold Plates.

Key Features

Optimized Heat Transfer Performance

Coolant flows through micro-channels inside the cold plate to absorb heat from the cooling surface. CreAlien applies fluid dynamics and thermal analysis to optimize channel design, helping maximize heat transfer performance under demanding operating conditions.

Semiconductor-Grade Manufacturing

High-precision machining capabilities support the production of cold plates with accurately controlled channel geometries and contact surfaces. This helps ensure consistent quality, reliable performance, and the precision required by semiconductor and high-performance computing applications.

Space-Efficient Thermal Design

Available installation is often limited in modern computing systems. CreAlien develops customized flow paths and cold plate configurations to maximize cooling performance within the constraints of each application.

Whether you’re cooling AI processors, power electronics, or other high-power devices, CreAlien can help develop a cold plate designed around your specific performance and integration requirements. Contact us to start your project!

Manifold

The Cooling Manifold serves as the highly reliable distribution backbone of a liquid cooling architecture. Designed for seamless integration into AI servers and high-density data centers, our manifolds are engineered with strict adherence to critical geometric tolerances and advanced machining processes. We deliver robust, leak-free pipeline solutions ready for scalable, rapid deployment.

Core Advantages:

Strict GD&T for Flawless Blind-Mating: We guarantee exceptional flatness, parallelism, and true positional accuracy. This precise control over geometric dimensioning and tolerancing (GD&T) ensures perfect alignment and smooth engagement for Quick Disconnect (QD) and blind-mate installations across the entire rack.

Optimized Surface Finish for Zero Leakage: To eliminate the risk of micro-leaks at critical joints, we rigorously control the surface roughness (Ra) at all connection interfaces. This meticulous surface finishing ensures a perfect, high-pressure seal for O-rings and mating components.

Advanced 5-Axis Machining Capabilities: For large, specialized, or highly customized inlet and outlet components, our in-house 5-axis CNC machining provides the capability to manufacture complex fluid-routing geometries with uncompromised structural integrity and precision.

Scalable Mass Production & Consistency: Leveraging highly automated manufacturing and stringent quality control, we ensure that every manifold—from initial prototyping to high-volume production—maintains the exact same dimensional accuracy, guaranteeing rapid lead times and high yield rates for large-scale data center rollouts.